In order to achieve MARIE´s goals it is divided into three project pillars: first, Models from measurements (M) aims to derive new models for material characterization and localization from extensive measurement campaigns; second, Chips from technology (C) realizes a novel dynamic transceiver technology in order to provide integrated circuits for mobile material characterization and localization; and third, Systems from concepts (S) investigates crucial signal processing concepts, e.g. adaptive THz beamforming and full duplex transmission, subject to technological and computational constraints so as to design mobile materialsensing systems.